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ParameterizedTransmissionlinemodel AccurateZo analysis Tracespacingandoffsets Solidvs.patternedground InsideofCadenceSiPandAPDandAllegro SetupoftheHFSSreadytosolveprojectintheCadenceenvironment Signalandpwr/gnd netselection Autoportcreationonsolderballs andbumps/bondwires PlaneExtentandHFSSSolutionSetupOptions Solution Automatedmergingcapabilities FullwaveandQuasistaticsolution StressModelingusingANSYSMechanicalincludes Jointstocapturethekinematics Viscoelasticmaterial Contactnonlinearity RigidflexibleinteractionĬPUandMemoryApplications FlipchipBGA NANDFlash(BGA,FDBGASiP,PoP etc.)ĭesignChallenges AccurateSYZandRLGCsolution Dealingwithmultiplevendors Partsthatareincontactbutmayseparateduetothedroptestareassignedbondedcontacts.īondedcontactsaremodeledasbreakablebasedonstresscriteriafordebonding. Initialvelocityof4.9m/secisassignedtotheTablet Meshing: ANSYSWorkbenchmeshingwithExplicitDynamicspreferenceisusedtocreateamesh.Īnalysissettings: Analysisissolvedfor4e4seconds. ThegeometryoftheTablePCwascreatedfromscratchusingANSYSDesignModeler ThegeometryoftheTablePCwascreatedfromscratchusingANSYSDesignModeler ThepartsaresimplifiedrepresentationsofpartsinanactualTabletPC.
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PerformDroptestofTabletPCfromheightof4feetontoaconcreteflooratanangleof45degreeusingANSYSExplicitDynamics SolutionTime(10x10electrodesmodel) 2hrs45min SupportsallavailablecoresĮlectrodescanningchange at contactedITO(IndiumTinOxide)position MeshConvergence RealTimeupdateofperformanceperadaptivesolutionĪccuracyofQ3DCapacitancesolution AutomatedMeshingRefinement Simulateprojectedand/ormutualcapacitance IncludeSkinandProximityEffects Builddetailed3DmodelĪdaptiveMeshRefinement Automaticallytunesthemeshtotheelectricalperformanceoftheĭevice.Thisensuressimulationsarecorrectthefirsttime. Nomovingpartspresent UseathinlayerofITO(indiumtinoxide)tosensethepresenceofafingerbycapacitivecoupling.Ĭapacitivesensorsaremountedunderneathofhardenedglass Fingeraddsameasurablecapacitivechangeinthetouchsensor ChangeinsensorcapacitancereliesonRCtimeconstantchange ResultDetailedandaccuratesystemsimulationapproachenablestabletstobeputonmarketontimewithreducedtestingcostsĭesignAspects Touchscreen TabletCase Packages Flexcircuitry Antenna ESD EMI SolutionAutomatedmodelingandoptimizedanalysisusingANSYSElectromagnetics toolsallowsforsystemsimulationapproach ProblemPredicttheperformanceofatabletdesignwhilemeetingstrictelectricalstandardsanddesignspecifications Shopping,reading,emailing,accessingsocialnetwork,playinggames